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Thermal Grease Paste Heat Sink Compound (10 Grams, Injection Type)
Composition: Silicone-based with conductive metal oxides.Thermal Conductivity: 3.0 - 12.8 W/mK (varies by product grade).Thermal Resistance: ≤ 0.01 °C-in²/W.Operating Temperature Range: -50°C to 300°C.Density: 2.5 - 3.5 g/cm³.Viscosity: Smooth paste consistency for easy application.Color: Gray or white (commonly).Weight: 10 grams.ApplicationsCPU and GPU cooling systems.Heat sinks for power transistors, diodes, and rectifiers.LED thermal management.Integrated chip thermal solutions.
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Composition: Silicone-based with conductive metal oxides.
Thermal Conductivity: 3.0 - 12.8 W/mK (varies by product grade).
Thermal Resistance: ≤ 0.01 °C-in²/W.
Operating Temperature Range: -50°C to 300°C.
Density: 2.5 - 3.5 g/cm³.
Viscosity: Smooth paste consistency for easy application.
Color: Gray or white (commonly).
Weight: 10 grams.
Applications
CPU and GPU cooling systems.
Heat sinks for power transistors, diodes, and rectifiers.
LED thermal management.
Integrated chip thermal solutions.
Thermal Conductivity: 3.0 - 12.8 W/mK (varies by product grade).
Thermal Resistance: ≤ 0.01 °C-in²/W.
Operating Temperature Range: -50°C to 300°C.
Density: 2.5 - 3.5 g/cm³.
Viscosity: Smooth paste consistency for easy application.
Color: Gray or white (commonly).
Weight: 10 grams.
Applications
CPU and GPU cooling systems.
Heat sinks for power transistors, diodes, and rectifiers.
LED thermal management.
Integrated chip thermal solutions.
Thermal Grease Paste Heat Sink Compound (10 Grams, Injection Type)
75 BDT
sold_units 14
1
Composition: Silicone-based with conductive metal oxides.
Thermal Conductivity: 3.0 - 12.8 W/mK (varies by product grade).
Thermal Resistance: ≤ 0.01 °C-in²/W.
Operating Temperature Range: -50°C to 300°C.
Density: 2.5 - 3.5 g/cm³.
Viscosity: Smooth paste consistency for easy application.
Color: Gray or white (commonly).
Weight: 10 grams.
Applications
CPU and GPU cooling systems.
Heat sinks for power transistors, diodes, and rectifiers.
LED thermal management.
Integrated chip thermal solutions.
Thermal Conductivity: 3.0 - 12.8 W/mK (varies by product grade).
Thermal Resistance: ≤ 0.01 °C-in²/W.
Operating Temperature Range: -50°C to 300°C.
Density: 2.5 - 3.5 g/cm³.
Viscosity: Smooth paste consistency for easy application.
Color: Gray or white (commonly).
Weight: 10 grams.
Applications
CPU and GPU cooling systems.
Heat sinks for power transistors, diodes, and rectifiers.
LED thermal management.
Integrated chip thermal solutions.
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